BLE. Ultra-small products based on LoRa and UWB application technologies.
Multiple antennas built-in, ultra-compact size.
Latest wireless SoC-based combo module
- 企業:インサイトSiP社 日本事務所(東京)
- 価格:Less than 10,000 yen
1~2 件を表示 / 全 2 件
Multiple antennas built-in, ultra-compact size.
Latest wireless SoC-based combo module
Consistent production is possible with thorough quality control from mold cutting to processing.
We are committed to developing new molding methods and mold manufacturing techniques without being constrained by conventional frameworks, providing short lead times and low-cost products. Regarding automation for large lots and dedicated processing machines, our experienced in-house staff design, manufacture, and maintain them from the user's perspective. *For more details, please refer to the related links or feel free to contact us.*